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PM-500 F系列液態(tài)感光阻焊軟板（FPC）油墨

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產(chǎn)品簡介

PM-500FW02是撓性板專用雙組份液態(tài)感光阻焊材料，采用絲網(wǎng)印刷

詳細(xì)介紹

PM-500 FW02是撓性板專用雙組份液態(tài)感光阻焊材料，采用絲網(wǎng)印刷。

耐熱性好，耐化金性能好。

低鹵素，符合RoHS和REACH要求。

PM-500 FW02 is liquid photo imageable solder mask for FPC for screen printing method with the following features.

Excellent Au plating resistance

Non-Halogen and accord with RoHS and REACH.

一、物性General properties

1	主劑Main agent	PM-500 FW02
2	固化劑Hardener	H-50 WHEA
3	顏色Color	白色wtite
4	主劑粘度Main agent’s Viscosity (at 25℃)	200±20P
5	固化劑粘度Hardener’s Viscosity (at 25℃)	80±20P
6	混合比例Mixing ratio	主劑Main agent：固化劑Hardener=7：3
7	混合后粘度Viscosity after mixed (at 25℃)	160±20dPa.s
8	混合后固體含量Non-volatile % after mixed	78±3%
9	混合后比重Specific gravity after mixed	1.2±0.05
10	混合后使用期限After Mixing Pot Life	24小時/24Hour (in dark place under 25℃)
11	保存期限Shelf life	6個月/ 6 month after production
12	包裝規(guī)格Package	1Kg/Cans（罐），10Kg/Box（箱）

二、應(yīng)用操作指引

基板表面處理		中粗化或微蝕化學(xué)處理，市水沖洗干凈
↓
開油		主劑與固化劑按7：3混合，添加適量稀釋劑，攪拌或震蕩5-10分鐘。
↓
靜置		10-20分鐘，使油墨充分排出開油時產(chǎn)生的氣泡，但不超過24小時。
↓
印刷		36T或者43T網(wǎng)印刷清潔篩網(wǎng)避開其他油墨污染，室溫20-25℃，濕度小于60%RH 印刷厚度要求濕膜在30-40um，干燥后20-25um。
↓
靜置		20分鐘以上，板材銅箔越厚，靜置時間應(yīng)越長，但不超過4個小時。
↓
預(yù)烤		兩面分別印刷、分別烘烤面熱風(fēng)循環(huán)烤箱：溫度70-75℃，時間10-20分鐘第二面熱風(fēng)循環(huán)烤箱：溫度70-75℃，時間15-30分鐘
↓
冷卻疊板		放置20分鐘以上使板材充分冷卻，但停放時間不超過24小時。疊板不易過多，疊板壓力不超過40 mmHg
↓
曝光		曝光能量一般在400-1000mj/cm² ，使用21級曝光尺保持感度在10-12格之間
↓
靜置		20分鐘以上，但不超過24小時
↓
顯像		壓力2.0-2.5kg/cm²濃度1wt% Na₂CO₃，液溫30±2℃，顯像時間70-90秒過顯影缸后，再用2.5-3.0kg/cm²噴淋壓力25℃左右的市水清洗45-60秒，使用2組以上海棉輪吸水，40℃以上熱風(fēng)吹干
↓
熱固化		普通板：150℃×60分鐘厚銅板（2OZ及以上）：段75℃×120分鐘、第二段100℃×30分鐘、第三段150℃×60分鐘
↓
絲印字符		絲網(wǎng)印刷設(shè)備及固化條件依字符油墨操作條件

Processing instructions

Pre-treatment		Copper surface roughening treatment Rinse with distilled water
↓
Mixing		Main agent and hardener agent in 7:3mix, add appropriate thinner, stir or shock 5-10 minutes
↓
Hold time		Hold time: within 20min after printing, But not more than 24 hours
↓
Coating		Screen printing by 36-43T polyester screen. Clean screen mesh to avoid other ink contamination. Room temperature: 20-25℃, Room humidity: under 60%RH. Printing wet film thickness requirements in more than 30-40 um, and above 20-25 um after drying.
↓
Hold time		Hold time: within 20min after printing, But not more than 4 hours
↓
Pre-cure		First side: by hot air dryer at 70-75℃ for 10-20min Back side: by hot air dryer at 70-75℃ for 15-30min Both side: by hot air dryer at 70-75℃ for 15-40min
↓
Laminate mask film		Hold 12-30min to cool down enough Laminate mask film in vacuum under 40 mmHg
↓
Exposure		400-1000mj/cm² (on resist surface) to 10-12 level vacuum under 650 mmHg
↓
Hold time		Hold 20 min after exposure，But not more than 24hours
↓
Developing		By 2.0-2.5kg/cm² Spraying of 1wt% Na₂CO₃ at 30±2℃ for 60-90sec Rinsing by 2.5-3.0kg/cm² spraying of water at below 25℃ for 45-60sec Taking off rinsing water by sponge roll and drying by hot air at 40℃ for several minutes
↓
Post cure		Cure resist film thoroughly by hot air dryer at 150℃ for 60min
↓
Screen print Marking ink		Screen printing and curing condition depend upon marking specification

三、ATTENTION ON EACH PROCESS

Operation environment should be clean room of 20-25deg.C and 50-60%RH under yellow lamp (UV cut) avoiding fluorescent and sunlight.

作業(yè)環(huán)境：無塵室內(nèi)溫度20-25℃，濕度50 - 60% ，黃燈下作業(yè)，避免熒光和陽光(避免紫外線)。

Open up the package when it becomes ambient temperature. Stir well before use.

常溫下開罐使用，使用前應(yīng)先攪拌均勻。

Appropriate coating thickness on cupper circuits after thermal cure is 10um-20um. Thinner coating thickness may cause lower resistance in solder heat, chemical and Ni/Au plating. Thick coating may cause under cut and insufficient tackiness.

線路上涂層干膜厚度應(yīng)在10 um-20um。薄涂層厚度可能會導(dǎo)致阻焊耐、化學(xué)鍍鎳/金性能下降。厚涂層可能導(dǎo)致側(cè)蝕過大及附著力不足。

Curing condition and window depend on oven type, batch size of work and curing condition of legend ink. Fink the optimum condition of your own

固化條件取決于烤箱類別，批量大小及油墨。客戶應(yīng)測試適合自己的條件

Exposure energy depends on material type of substrate or coating thickness. Find the optimum condition of your own based on resolution (undercut level), gross level, shoot-through, etc

曝光能量取決于基材類型和涂層厚度。找到自己的條件，以達(dá)到的分辨率。

Control well the quality of developing agent in its density, temperature, spray pressure and dwelling time. Insufficient control may case deterioration in developing or under cut.

控制好顯影液的濃度、溫度、噴射壓力和顯影時間?？刂撇涣伎赡軐?dǎo)致顯影不良側(cè)蝕過大等。

Set optimum curing condition and window with consideration of curing condition for legend ink. Shortage or excess cure may cause degrade of Coating properties.

設(shè)置的操作條件要注意油墨的固化條件。固化時間過長或不足都可能導(dǎo)致降低涂料的性能

In case Ni/Au plating, set optimum curing condition and window with Consideration of curing condition for legend ink. Over curing cause lower Ni/Au plating resistance.

鍍鎳/金，設(shè)置固化條件和顯影條件。固化過度可導(dǎo)致抗鍍鎳/金性能下降。

四、CHARACTERISTICS

(1) DEVEL OPMENT TOLERANCE WINDOW顯影寬容度：

Drying time

固化時間

80deg.C

40 min

80deg.C

50 min

80deg.C

60 min

80deg.C

70 min

Developability

顯影能力

Clean

干凈

Clean

干凈

Clean

干凈

Slight Residue

輕微不凈

(2)PHOTO SENSITIVITY 感度：

Item

項目

Thickness

厚度

Energy

能量

Developing time

顯影時間

Sensitivity

感度

Sensitivity

Kodak No.2

柯達(dá)2#感光尺

20±2um

400mJ/cm²

280mJ/cm²

60 sec.

5step

500mJ/cm²

350mJ/cm²

6step

600mJ/cm²

420mJ/cm²

7step

The exposure energy is measured on under artwork film (on solder mask) by using Digitimes 7Kw, metal halide lamp. 以上測試結(jié)果基于本公司志勝7KW曝光機(jī)，曝光尺在防焊膜上菲林下測試結(jié)果。

五、PROPERTIES 涂膜物性

ITEM

項目

TEST METHOD

測試方法

RESULT

測試結(jié)果

Adhesion

附著力

Coants Internal Test Method

Cross hatch/Tape peeling

百格法/膠帶剝離

100/100

Pencil hardness

鉛筆硬度

Coants Internal Test Method

No scratch on copper surface

銅表面上沒有劃痕

Solder heat resistance

耐熱性

Rosin flux 260deg.C/10sec.1cycle

Solder bath floating test

浮錫測試260℃*10秒*1次

Pass

Solvent resistance

耐溶劑

PMA-AC, 20deg.C/20min.immersion

Cross hatch/Tape peeling

PGM-AC*20℃*20分鐘

Pass

Acid resistance

耐酸性

10vol% HCl, H₂SO₄, 20deg.C/20min.immersion,

Cross hatch/Tape peeling

Pass

Alkaline resistance

耐堿性

10wt% Na OH, 20deg.C/20min.

Immersion, Cross hatch/Tape peeling

Pass

Insulation resistance

絕緣電阻

IPC comb type B pattern

25-65deg.C,90%RH

DC100V for 7 days

Measurement：DC500V/1min.

Value at room temperature

Initial初始值

2.8*10×10¹³Ohm

Conditioned終值

6.6×10¹²Ohm

Dielectric constant

介電強(qiáng)度

25-65deg.C,90%RH

DC100V for 7 days

Measured at 1MHz/room

temperature

Initial初始值 4.3

Conditioned終值 4.5

Dissipation factor

介電常數(shù)

25-65deg.C,90%RH

DC100V for 7days

Measured at 1MHz/room

temperature

Initial初始值 0.030

Conditioned

終值0.042

Electroless Au plating

耐化學(xué)金性

Coants lab. Method

Ni 3um/Au 0.03um

Pass

*All test data mentioned above in this technical data sheet are based on our laboratory test result and just for reference, not guarantee the same in your process.

以上所測數(shù)據(jù)是基于我們的實驗室試驗結(jié)果和參考，不能保證之用。

若英文內(nèi)容與中文內(nèi)容有差異，以中文為準(zhǔn)。

In case of any discrepancy between the English and Chinese content, the Chinese version shall prevail.

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